Galvanic

Quality prototype boards must ensure proper electrical connectivity between the top, bottom, and inner layers. Through-hole plating typically reduces the board’s layout density and the number of vias. LPKF provides several effective through-hole plating solutions, based on board complexity.

Galvanic Through-Hole Plating

Specially developed to produce the highest professional-quality through-hole plating results for double-sided and multilayer boards. These galvanic systems apply reverse pulse plating technology, which provides uniform copper plating as well as plating of difficult aspect ratios and very small holes.

Reverse pulse plating avoids the “bone effect” (thicker copper growth at the hole entrance) that can clog up small via holes entirely before they are completely plated. It is very useful for achieving quality plating results with small holes on high-density PCBs, and for improving production reliability during soldering.

With respect to galvanics LPKF Laser & Electronics AG offers various systems for through-hole plating circuit boards and multilayers with up to six layers.

In addition to galvanic through-hole plating LPKF also offers a mechanical and entirely non-chemical method of through-hole plating.