Cutting and Drilling of Ceramics

LPKF systems can cut, drill, and skive green or fired ceramic materials like Alumina, silicon nitride, and polycrystalline silica. This is useful for cutting the outline or inner contours of ceramic boards.

The LPKF ProtoLaser S is an ideal tool for working with ceramic substrates. The laser beam removes metal coating on ceramic substrates precisely and quickly – up to thicknesses of 300 μm.