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Printed-Circuit-Boards

PCB Processing

Cutting, Drilling and Structuring
of PCBs (Printed Circuit Boards)

Applications & Technologies

PCB Processing

Cutting, Drilling and Structuring
of PCBs (Printed Circuit Boards)

You are here: Applications > PCB Processing > PCB Processing
Cutting of Multilayers
Laser cuttings of flexible, flex-rigid and thin multilayers.

Processing of Polymers
Laser machining of flexible and rigid polymers with highest precision.

Drilling of Microvias
UV laser drilling of Microvias with finest hole diameters.
Repairing of PCBs
Laser rework and repair of printed circuit boards.

Conductive Pattern Creation
Laser structuring for the production of conductive patterns.

Application Reports
Reports about the lasers processing of different applications.

More information
LPKF Laser & Electronics AG
 
Osteriede 7
30827 Garbsen
Germany
 
Tel.:
+49 (0) 5131 7095-0
Fax:
+49 (0) 5131 7095-90
E-Mail:
Contact form


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