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Drilling of Microvias
UV laser drilling of microvias with hole diameters < 50 µm

Microvia, D = 75 µm in RCC
An efficient technology for the production of Microvias by opening the copper and removing the epoxy and glass fibre, in one processing step.
Advantages of UV laser drilling
- Drilling different materials
- RCC®
- PTFE
- FR4 and FR5
- Thermount®
- no delamination and reduced pink ring effect
- automatic correction of the position and of material dilation through
- registration of the fiducials and on-line scaling
- high precision and positional accuracy of the drill holes
- ideal drill hole geometry
LPKF Laser & Electronics AG Osteriede 7 D-30827 Garbsen Germany Tel.: +49-(0)5131-7095-0 Fax: +49-(0)5131-7095-90
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