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Application Reports

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Drilling microvias in HDI circuit boards
pdf ( 149 KB )

Laser Cutting and Drilling of High-Frequency Circuit Board Materials
pdf ( 216 KB )

Laser Cutting rigid-flex and thin rigid multilayer circuit boards
pdf ( 256 KB )

Laser Removal of chemical tin for the production of ultra-fine lines
pdf ( 288 KB )

Laser Repair and Rework of Bare and Assembled Boards
pdf ( 166 KB )

Laser Structuring of Conductive
TCO / ITO Coatings
pdf ( 216 KB )

Micromachining of Ceramic Materials
pdf ( 367 KB )

Opening Solder-Resists
pdf ( 84 KB )

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LPKF Laser & Electronics AG

Osteriede 7
30827 Garbsen
Germany

Tel.:

+49 5131 7095-0

Fax:

+49 5131 7095-90

E-Mail:

LPKF Laser & Electronics AG Osteriede 7 D-30827 Garbsen Germany Tel.: +49-(0)5131-7095-0 Fax: +49-(0)5131-7095-90

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