PCB Depaneling

Components and printed circuit boards are becoming smaller and more sensitive. When unassembled or assembled separate boards are depanelled from a multi-image board, it is very important to reduce the forces acting on the board to a minimum. The criteria for precision and cleanliness are also becoming more and more stringent at the same time. Laser systems cut any shape of contour without exerting any mechanical stress – and do so much more precisely than conventional tools such as saws, routers or punches.

The laser cuts virtually any shape with minimal spaces between the single PCBs. Densely populated boards and closely arranged panels provide for an increased net usable surface.

In the case of flexible and very thin substrates in particular, lasers open up new options for the production of sensitive printed circuit boards.

The LPKF MicroLine series is perfect for cutting break-out tabs and complex contours in rigid, rigid-flex and flexible PCB substrates. The systems provide clean cuts in PI, FR4, FR5, and CEM materials. Further materials include polyesters, ceramics and other RF-materials.

The LPKF circuit board plotters are suited for mechanical depaneling of PCBs in low number of items.