Drilling Microvias
UV LASER Drilling of Microvias with hole diameters < 50 µm

Microvia, D = 75 µm in RCC
An efficient technology for the production of Microvias by opening the copper and removing the epoxy and glass fibre, in one processing step.
Advantages of UV laser drilling
- Drilling different materials
- RCC®
- PTFE
- FR4 and FR5
- Thermount®
- no delamination and reduced pink ring effect
- automatic correction of the position and of material dilation through
- registration of the fiducials and on-line scaling
- high precision and positional accuracy of the drill holes
- ideal drill hole geometry