Applications > PCB Cutting Technology > Drilling of Microvias
 
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Drilling Microvias

UV LASER Drilling of Microvias with hole diameters < 50 µm

Microvia, D = 75 µm in RCC
An efficient technology for the production of Microvias by opening the copper and removing the epoxy and glass fibre, in one processing step.







Advantages of UV laser drilling
Application reports
Fax request  (55 KB)

More information
For further questions and information please contact our Laser-Department.

Tel.: +49-(0)5131-7095-0
Fax: +49-(0)5131-7095-90

Email: info@lpkf.de

LPKF Laser & Electronics AG      Osteriede 7      D-30827 Garbsen      Germany      Tel.: +49-(0)5131-7095-0      Fax: +49-(0)5131-7095-90