Cutting

Laser cuttings of flexible, flex-rigid and thin multilayers

a completely cut outrigid-flexible printed circuit board

• clean cutting edges, no burring
• cuts of extremely fine contours and practically radius-free corners
• minimal thermal influence, i.e. no delamination
• cuts of different material thicknesses and combinations in one processing step
• seperation of assembled circuit boards
• contact-free material processing, thereby no material distortion
• no fixture or protective cover necessary
• high precision and positional accuracy of the edges, through automatic registration of fiducials.