Solder Resist Masks and Dry Film Resists

Selective removal of solder resists and dry film resists

Lasers are especially suitable for selective removal of solder resists. They can create openings in solder resists and cover foil to a degree of fineness, which is no longer achievable with the using printing or exposure procedures.






Advantages of the laser:

• finest openings within the HDI range < 50 µm in the solder resist are possible
• finest openings cover foils, e.g. Polyamide
• no damage to copper surface, residue-free copper surface
• no film production, direct CAD data conversion
• automatic registration of fiducials
• automatic correction of position and material dilation by on-line scaling
• high precision and positional accuracy of the openings