Tin resist technology

Production of 50 µm lines and spaces by laser structuring chemical tin

Tin resist patterning is outstandingly suited to the production of high density areas on HDI Multilayers. The complete copper plated base material is first chemically coated with a homogeneous tin surface. Subsequently, the tin resist is removed by the laser where etching is desired.

Advantages of laser structuring

• no photolithography
• reduction of technology steps
• Areas with <50 µm lines and spaces are possible
• efficient decrease of PAD diameters as well as lines and spaces
• especially suitable for small areas with high desity circuits, i.e. large areas are conventionally made with photolithography, small areas made by means of laser structuring
• automatic correction of positional errors and material distortion caused by processing, by fiducial registration of inner and outer layers and on-line scaling
• compatible with standard plating and etching processes
• structuring directly from CAD data