Panel Plating

Production of HDI Circuits using panel Plating by structuring of standard resist

Different to pattern plating with the panel plating process the track pattern is produced by etching the final copper thickness. By means of laser structuring the already exposed resist serves as an etch resist. Finest structures can also be produced here depending on the final copper thickness. The laser structuring can be applied to dry film or lacquer resists.

Advantages of laser structuring

• HDI circuit areas with < 50 µm lines and spaces are  possible
• efficient decrease of PAD diameters as well as
• especially suitable for small areas with high density devicesi.e. large areas are produced by conventional photolithography, small areas are structured by means of laser
• automatic correction of position and process-causedmaterial distortion by registration of the fiducials and on-line scaling.
• Compatible with standard plating and etching processes
• structuring directly from CAD data