International Site
Applications Overview
Rapid PCB Prototyping
SMT Stencil Technology
PCB Cutting Technology
Conductive Pattern Creation
Resist Structuring
About Resist Structuring
Tin Resist Technology
Pattern Plating
Panel Plating
Resist Exposure
Solder Resists and Foils
Drilling of Microvias
Cutting
Repair & Rework
Flexible & Rigid Polymers
Application Reports
MID
Laser Micromachining
Resist Structuring
About Resist Structuring
Advantages of laser structuring of etching and plating resist.
Tin Resist Technology
Production of 50 µm lines and spaces by laser structuring chemical tin.
Advantages of laser structuring of etching and plating resist.
Tin Resist Technology
Production of 50 µm lines and spaces by laser structuring chemical tin.
Pattern Plating
Production of HDI circuitry by laser structuring of conventional photo resist.
Panel Plating
Production of HDI Circuits using panel Plating by structuring of standard resist.
Production of HDI circuitry by laser structuring of conventional photo resist.
Panel Plating
Production of HDI Circuits using panel Plating by structuring of standard resist.
| More information |
| For further questions and information please contact our Laser-Department. Tel.: +49-(0)5131-7095-0 Fax: +49-(0)5131-7095-90 Email: info@lpkf.de |
© by lpkf
LPKF Laser & Electronics AG Osteriede 7 D-30827 Garbsen Germany Tel.: +49-(0)5131-7095-0 Fax: +49-(0)5131-7095-90