Conductive Pattern Creation

Resist Structuring
Laser direct structuring of etching or plating resist.

Resist Exposure
Laser direct imaging of photo resist.

Solder Resists and Foils
Opening solder stop resists and cover foils.

Laser structuring for the production of conductive patterns

The substantial rise in density of printed circuit board led to an innovation in the production technology of printed circuit boards. The conventional photolithographic film exposure method sets physically and economically limits on the demanded increase in density of the conductive pattern. Due to material problems as well as film registration and positioning problems the yield of PCB’s can be considerably lower. Frequently high integration densities are demanded within an HDI PCB only in small areas of the board. While a majority of the board can be manufactured by the means of conventional  photolithographic processes , the laser structuring and/or imaging of the high density area is an efficient economic alternative for the production of  printed circuit boards with 50 µm lines and spaces providing a much higher yield.