MID is the abbreviation for "Molded Interconnect Device". The goal of MID technology is to unite electrical and mechanical functions in a single construction unit. The circuit tracks are integrated here into the housing as a substitute for a conventional printed circuit board. As a result, weight and fitting space can be effectively reduced.
The three-dimensional circuit carrier is injection molded from a modified polymer material. The modification allows laser activation of circuit tracks on the surface of the circuit carrier. The activated areas become metallized in a chemical metallization bath in order to build conductive tracks.