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What is MID?


 
MID is the abbreviation for "Moulded Interconnect Device". The goal of MID Technology is to unite electrical and mechanical functions in a single construction unit.
 
The circuit tracks are integrated here into the housing as a substitute for a conventional printed circuit board. As a result, weight and fitting space can be effectively reduced.

At present the predominantly used processes are:

Since 1997, LPKF has developed MID Technology as a laser-based procedure for the production of MID's called: The LPKF-LDS Process.

The three-dimensional circuit carrier is injection moulded from a modified polymer material. The modification allows laser activation of circuit tracks on the surface of the circuit carrier. The activated areas become metallized in a chemical metallization bath in order to build conductive tracks.
Product information
WMV (11.50 MB)

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Nils Heininger
Nils Heininger
Vice President PCB/MID Equipment

Tel: +49-(0)5131-7095-0
Fax: +49-(0)5131-7095-90
Email: n.heininger@lpkf.de

Dr. Wolfgang John
Dr. Wolfgang John
Senior LPKF-LDS Consultant

Tel.: +49-(0)5131-7095-0
Fax: +49-(0)5131-7095-90
Email: w.john@lpkf.de

LPKF Laser & Electronics AG      Osteriede 7      D-30827 Garbsen      Germany      Tel.: +49-(0)5131-7095-0      Fax: +49-(0)5131-7095-90