What is MID?

MID is the abbreviation for "Molded Interconnect Device". The goal of MID technology is to unite electrical and mechanical functions in a single construction unit. The circuit tracks are integrated here into the housing as a substitute for a conventional printed circuit board. As a result, weight and fitting space can be effectively reduced.

The three-dimensional circuit carrier is injection molded from a modified polymer material. The modification allows laser activation of circuit tracks on the surface of the circuit carrier. The activated areas become metallized in a chemical metallization bath in order to build conductive tracks.

Since 1997, LPKF has developed MID technology as a laser-based procedure for the production of MID's called: The LPKF-LDS™ process (laser direct structuring).

At present the predominantly used processes are:

• laser direct structuring (additive and subtractive)
• two-shot injection moulding
• hot embossing
• insert moulding