What is MID?

MID is the abbreviation for "Moulded Interconnect Device". The goal of MID Technology is to unite electrical and mechanical functions in a single construction unit.
 
The circuit tracks are integrated here into the housing as a substitute for a conventional printed circuit board. As a result, weight and fitting space can be effectively reduced.

At present the predominantly used processes are:

• two-shot injection moulding
• hot embossing
• insert moulding
• laser structuring (additive and subtractive)

Since 1997, LPKF has developed MID Technology as a laser-based procedure for the production of MID's called: The LPKF-LDS Process.

The three-dimensional circuit carrier is injection moulded from a modified polymer material. The modification allows laser activation of circuit tracks on the surface of the circuit carrier. The activated areas become metallized in a chemical metallization bath in order to build conductive tracks.