Material Selection / Design

A number of series materials or thermoplastics are available to produce injection-moulded MIDs for the LPKF-LDS method. These materials are suitable for a large number of different applications thanks to their broad spectrum of properties:

PA6/6T (semi-aromatic polyamide), based on Ultramid® (BASF AG)

• very high thermal shape stability, suitable for reflow soldering (also with lead-free solder)
• very good mechanical properties

Thermoplastic polyester (PBT, PET and blends), based on Pocan® (LANXESS)

• very good mechanical and electrical properties
• very high thermal shape stability with addition of PET

Crosslinked PBT (polybutylenterephathalate), based on Vestodur® (Evonik)

• migration-resistant fire protection equipment (VO - 0.4 mm after UL94)
• irradiation crosslinkable for high temperature resistance (all soldering processes)

LCP (Liquid Crystal Polymer), based on Vectra® (Ticona GmbH)

• very good flow properties
• very good dimensional stability under thermal stress

PC/ABS (polycarbonate / acrylnitrile / butadiene / styrol)*

• very good surface properties
• very good mechanical properties

* under development