LPKF-LDS Process

State-of-the-art

2-component injection moulding and hot stamping are already used to manufacture MIDs (Moulded Interconnect Device). Both of these methods are tied to product-specific tools to create a circuit on the component.

The associated high initial manufacturing costs considerably limit the efficiency of these methods for small production runs and design modifications. Prototyping shortly before series production is almost impossible.

Moreover, increasing miniaturisation of the circuits on MID components leads to a considerable rise in tooling-up time and expense.

The LPKF-LDS method is a flexible and economic alternative.

Advantages of the LPKF-LDS method

More flexibility because the laser directly transfers the artwork from the computer to the injection-moulded component, so no additional tools or masks are required. Structuring takes place solely on the basis of the existing CAD data.

Tooling costs significantly reduced because laser-structurable MIDs can be made using 1-component injection moulding.

Lasers are ideal for the production of ultra-fine structures.

High cost efficiency for fine structures and small to medium production runs in particular.

Highly pro-environment because no caustic or etching chemicals are used.