Activating through-holes

To ensure that the laser can process the inside walls of the through-plated hole at a suitable angle of incidence, the vias have to be conical on one side or both sides depending on the thickness of the material. In the case of thick walls, the internal diameters of the vias must be enlarged to ensure unimpeded processing by the laser beam (aspect ratio of simple cones 1:1; for double cones 2:1).