Applications > LIDE Technology > Laser Induced Deep Etching (LIDE)

Menu
LIDE - Laser Induced Deep Etching

LIDE - Laser Induced Deep Etching

You are here: Applications > LIDE Technology > Laser Induced Deep Etching (LIDE)
 
Innovation
A highly productive laser system and an innovative process technology are revolutionizing the machining of thin glass substrates. With the Laser Induced Deep Etching (LIDE) process and the LPKF Vitrion laser system, micro-structuring of glass is now easier and more economical than before.

In microsystems technology, thin glass with a thickness of 50 µm to 500 µm is very suitable as a substrate material for a variety of applications. However, because it is prone to microcracking and stress formation when machined using conventional methods, its industrial-scale use has failed time and time again. The new LIDE process by LPKF Laser & Electronics AG in conjunction with the LPKF Vitrion 5000 system uses the laser as a noncontact precision tool for micromachining glass with unrivaled productivity and quality. The processing is easy and amazingly fast.

LIDE makes new product designs in microsystems technology possible and has the potential to transform entire process chains in production.

How does this work? Click the next tabs, find the answer and see what is possible when using this technology.

Technology

How to machine ultrathin glass


The Challenge

  • Conventional processing methods for cutting and drilling thin glass often cause microcracks or stresses, which compromise quality and can lead to component failure. Quality deficiencies make the use of glass in industrial microsystems technology uneconomical.
  • Especially in thin glass substrates with thicknesses of 50 μm – 500 μm, structures cannot be generated with the high aspect ratios required for applications in microtechnology. The embedded structures are not small and precise enough for many applications.
  • The production speed for fragile glass substrates is too low for conventional materials to be used economically.

The Solution

The Laser Induced Deep Etching (LIDE) process by LPKF is a two-step process. In the first step, the glass is locally laser-modified according to the desired layout. This is done by laser radiation from a specially developed source. The radiation is focused within the workpiece and guided through its entire thickness. The optical and chemical properties of the material are modified to enable selective chemical etching in a second process step. The modified areas of the glass are removed much more rapidly than the unmodified material is. In order to yield structures with specific widths, the glass is soaked in the etching bath for a predefined time.

Laser Induced Deep Etching Process


The Possibilities

The package comprising the innovative LIDE process and a new high-end laser system paves the way for numerous new applications in
  • microfluidics
  • display manufacturing
  • MEMS technology
  • chip manufacturing

Drilling Mode
Through-Glass Via (TGV) Drilling Mode

To prepare holes and cuts in glass substrates, LPKF uses its Vitrion 5000 System. The machine is equipped with a high-speed axis. In the drilling operation mode, the system prepares Through Glass Vias (TGV). The mentioned axis of the Vitrion 5000 is used to scan the glass substrate in a meandering way. The laser pulses of the specifically developed laser source are emitted according to the desired TGV pattern design while the axis is traveling at full speed. This means that the laser pulses are emitted on the fly. Thus, a laser processing speed of > 5000 TGV modifications per second can be reached in this mode - with glass thicknesses of up to 500 μm.

After laser modification, the glass is modified in a multitude of spots placed with a position tolerance of ± 5 μm (Cpk > 1.33) across an area of 510 mm x 510 mm. These modified areas can be transformed into blind or through holes in the subsequent wet etching step. Without further measures being taken, the modified regions are removed by the etching solution on both sides of the glass substrate to yield hourglass-shaped holes.

V-shaped vias are obtained through masking of one side of the glass during the etching step. Typical taper angles range from 3° to 8°, depending on the nature of the glass and the chemical composition of the bath.

Application Examples

Microscopic holes and hole shapes in glass
Microscopic holes and hole shapes in glass; high quality without any microcracks
One laser pulse modifies the glass; holes are formed in the subsequent etching process.
One laser pulse modifies the glass; holes are formed in the subsequent etching process

Micro-cutting Mode
Micro-cutting Operation Mode

The LPKF Vitrion 5000 can be operated in a micro-cutting mode. In this case, the laser beam is moved along an arbitrary two-dimensional tool path. The laser pulses are emitted at equal distances along the path, resulting in a curtain of modified regions extending from one side of the glass substrate to the other. As in the TGV operation mode, the final features are then generated through removal of the modified areas of the glass by etching. The minimal feature size is in the range of 10 μm. The modification speed in this mode is up to 100 mm/s and is independent of the glass thickness up to a thickness of 500 μm.

Application Examples



Kirigami with glass - due to the high cutting quality, even the stretching of glass is possible



Microfluidic channel in ultra thin glass
Microfluidic channel in ultra thin glass
Spring-mounted MEMS for use in passive micro positioning
Spring-mounted MEMS for use in passive micro positioning

Download
Brochure LPKF Vitrion 5000 (pdf)

More Information


Group Technology Management
 
Tel.:
+49 (0) 5131 7095-0
E-Mail:
Contact form



LPKF Group Sites
LPKF WeldingQuipment
LPKF SolarQuipment
LaserMicronics
ZelFlex Stretching Frames

LPKF Distributors
Europe
Austria   
Belgium   
Bosnia and Herzegovina   
Croatia   
Czech Republic   
Danmark   
Estonia   
Finnland   
France   
Greece   
Hungary   
Ireland   
Italy   
Latvia   
Lithuania   
Luxembourg   
Macedonia   
Montenegro   
Netherlands   
Norway   
Poland   
Portugal   
Romania   
Russia   
Serbia   
Slovenia   
Spain   
Sweden   
Switzerland   
Turkey   
Ukraine   
United Kingdom   
America
Argentina   
Brazil   
Canada   
Chile   
Colombia   
Mexico   
Peru   
USA   
Venezuela   
Asia
China   
Hong Kong   
India   
Indonesia   
Iran   
Israel   
Japan   
Jordan   
Korea   
Malaysia   
Pakistan   
Philippines   
Saudi Arabia   
Singapore   
Taiwan   
Vietnam   
Africa
Algeria   
Egypt   
Kenya   
Morocco   
Nigeria   
South Africa   
Tunesia   
Australia
Deutsch
Español
Français
Русский
Slovenščina
日本語
中文
Knowledge Center Knowledge-Center
Newsletter 
LinkedIn  LinkedIn
Facebook 
Twitter 
YouTube 
RSS 
<