Thin Layer Structuring 

Manufacturing of fine structures < 15 µm

Thin metallic (Cu, Al, Pd, Pt...) or organic layers (conductive polymers, organic dielectrics...) with a thickness of up to 200 nm on flexible or rigid substrates are ablated with the help of the mask projection procedure and thus structured.

The layout is on a quartz mask and reduced on the substrate as illustrated. The laminar laser ablation guarantees the highest throughput.

Advantages of the LDP process

• no photolithography
• reduction of technology steps
• high throughput by reel to reel process
• no aggressive etching process
• no chemicals
• pollution free
• easily integrated into existing production lines
• yields > 90%
• recovery of the ablated material possible
• high resolution, precision and process speed