Applications > Laser Micromachining > Ceramics > Micro Scribing
 
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Micro Scribing

Laser scribing

AlN of 1 mm thickness cut and broken
Laser scribing initially involves introducing 20 to 50 µm deep groove into the ceramic material. The material is then broken along this groove. A clean separation of segments with high quality and accuracy is thereby made possible.

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For further questions and information please contact our Laser-Department.

Tel.: +49-(0)5131-7095-0
Fax: +49-(0)5131-7095-90

Email: info@lpkf.de

LPKF Laser & Electronics AG      Osteriede 7      D-30827 Garbsen      Germany      Tel.: +49-(0)5131-7095-0      Fax: +49-(0)5131-7095-90