Applications > Laser Micromachining > Ceramics > Micro Scribing
Micro Scribing
Laser scribing

AlN of 1 mm thickness cut and broken
Laser scribing initially involves introducing 20 to 50 µm deep groove into the ceramic material. The material is then broken along this groove. A clean separation of segments with high quality and accuracy is thereby made possible.
Fax request (55 KB)
For further questions and information please contact our Laser-Department.
Tel.: +49-(0)5131-7095-0
Fax: +49-(0)5131-7095-90
Email: info@lpkf.de |
© by lpkf
LPKF Laser & Electronics AG Osteriede 7 D-30827 Garbsen Germany Tel.: +49-(0)5131-7095-0 Fax: +49-(0)5131-7095-90