Applications > Laser Micromachining > Ceramics > Micro Drilling
 
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Micro-Holes

Laser drilling

Laser drilling makes the production of the smallest hole diameters possible (for example < 75 µm in LTCC with high aspect ratios).
50 µm throughholes in sintered Green Tape thickness 254 µm

Application reports
Fax request  (55 KB)

More information
For further questions and information please contact our Laser-Department.

Tel.: +49-(0)5131-7095-0
Fax: +49-(0)5131-7095-90

Email: info@lpkf.de

LPKF Laser & Electronics AG      Osteriede 7      D-30827 Garbsen      Germany      Tel.: +49-(0)5131-7095-0      Fax: +49-(0)5131-7095-90