International Site
Applications Overview
Rapid PCB Prototyping
SMT Stencil Technology
PCB Cutting Technology
MID
Laser Micromachining
ITO Layer Structuring
Thin Layer Structuring
Glass Structuring
Ceramics
Advantages of laser micromachining
Micro Scribing
Micro Drilling
Cutting
Ceramics
Advantages of laser micromachining
Advantages of the laser micromachining of ceramics.
Micro Scribing
Laser scribing of ceramic material for the separation of segments.
Advantages of the laser micromachining of ceramics.
Micro Scribing
Laser scribing of ceramic material for the separation of segments.
Micro Drilling
Laser drilling of smallest hole diameters with laser technology.
Cutting
Producing continuous cuts with the laser.
Laser drilling of smallest hole diameters with laser technology.
Cutting
Producing continuous cuts with the laser.
| More information |
| For further questions and information please contact our Laser-Department. Tel.: +49-(0)5131-7095-0 Fax: +49-(0)5131-7095-90 Email: info@lpkf.de |
© by lpkf
LPKF Laser & Electronics AG Osteriede 7 D-30827 Garbsen Germany Tel.: +49-(0)5131-7095-0 Fax: +49-(0)5131-7095-90