Cutting

Laser cutting

Break-through in 630 µm thick sintered Ceramic substrate

Lasers can produce a continuous cut or a cut joint, e.g. as a cut out or outline cut. A substantial characteristic of laser treatment is the resultant finest structures with high-quality edges.

Application reports

Fax request (55 KB)

More information

For further questions and information please contact our Laser-Department.

Tel.: +49-(0)5131-7095-0
Fax: +49-(0)5131-7095-90

Email: info@lpkf.de

LPKF Laser & Electronics AG Osteriede 7 D-30827 Garbsen Germany Tel.: +49-(0)5131-7095-0 Fax: +49-(0)5131-7095-90