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Rapid PCB PrototypingIC PackagingSMT Stencil TechnologyPCB ProcessingPCB DepanelingMID / LDS TechnologyLaser Plastic WeldingLaser Transfer PrintingLIDE Technology

Applications

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Applications

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Rapid PCB Prototyping
Systems for developing, manufacturing and assembling prototype circuit boards.

IC Packaging
Sophisticated connection technologies for producing high integrated electronic components.

SMT Stencils
Cutting of SMT stencils by laser technology and stencil quality check-up.

PCB Processing
Cutting, drilling and structuring of printed circuit boards and flexible circuit carriers.

PCB Depaneling
Stress-free depaneling of assembled printed circuit boards with laser technology.
MID (Mechatronic Integrated Devices)
Structuring of 3D circuit carriers by the LPKF-LDS method.

Laser Micromachining
Processing of ceramics, thin metallic and organic layers and ITO layers.

Laser Plastic Welding
Bonding of plastic using high-precision laser welding systems.

Laser Transfer Printing
Digital printing of highly filled inks with no masks or screens.

LIDE Technology
Technology for micro-structuring of glass substrates with the laser.

More information
LPKF Laser & Electronics AG
 
Osteriede 7
30827 Garbsen
Germany
 
Tel.:
+49 (0) 5131 7095-0
Fax:
+49 (0) 5131 7095-90
E-Mail:
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