Applications > IC Packaging > Overview

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Through-Glass ViaMEMS Packaging Technology

IC Packaging

Applications & Technologies

IC Packaging

You are here: Applications > IC Packaging > Overview
TGV Process
The LPKF TGV Process generates highly precise holes for subsequent through-hole plating.
LDS MEMS Packaging
Three dimensional solutions for compact chip stacking.

More information
LPKF Laser & Electronics AG
 
Osteriede 7
30827 Garbsen
Germany
 
Tel.:
+49 (0) 5131 7095-0
Fax:
+49 (0) 5131 7095-90
E-Mail:
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